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Please use this identifier to cite or link to this item: https://ela.kpi.ua/handle/123456789/42769
Title: Remediation of Soil Containing Sludge Generated by Printed Circuit Board Production and Electroplating
Other Titles: Забруднення ґрунту у разі зберігання шламу, який утворюється при гальванічному виробництві
Authors: Nester, Аnatoliy
Tretyakova, Larisa
Mitiuk, Liudmyla
Prakhovnіk, Natalya
Husiev, Arkadii
Keywords: production of printed circuit boards
regeneration
etching solutions
environmental hazard
sludge
Issue Date: 2020
Publisher: Kaunas University of Technology
Citation: Remediation of Soil Containing Sludge Generated by Printed Circuit Board Production and Electroplating / Anatolyi Nester, Larisa Tretyakova, Liudmyla Mitiuk, Natalya Prakhovnik, Arkadii Husiev // Environmental Research, Engineering and Management. – 2020. – Vol. 76, No. 4. – Pp. 68–75.
URI: https://ela.kpi.ua/handle/123456789/42769
DOI: https://doi.org/10.5755/j01.erem.76.4.25460
Appears in Collections:Статті (ОППЦБ)

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